I am making some fragile structures on a 4" wafer
which
is needed to be diced later on.  I am worrying when I
dice the wafer the structures would be destroyed. I
wonder if anyone has any experience on this and can
provide some insight.  Namely, the structure would be
a mirror (500um x 500um)  of 2 um - 10 um thickness
held by two hinges of 5 x 100 um.  There might be an
oxide layer of about 1 um holding thing up. Could you
send me a note on this if you did something like that?


Thanks,
MD

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