Use blue tape as underneath pad when dicing.

Dinh Ton wrote:

> I am making some fragile structures on a 4" wafer
> which
> is needed to be diced later on.  I am worrying when I
> dice the wafer the structures would be destroyed. I
> wonder if anyone has any experience on this and can
> provide some insight.  Namely, the structure would be
> a mirror (500um x 500um)  of 2 um - 10 um thickness
> held by two hinges of 5 x 100 um.  There might be an
> oxide layer of about 1 um holding thing up. Could you
> send me a note on this if you did something like that?
>
> Thanks,
> MD
>
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--
Regards,
*******************************
Jiangang Du(John Duke)
Glennan 508
EECS Dept.
Case Western Reserve Univ.
Tel:(216)3684947
*******************************