In my mems fabrication, I need to align two Si wafers with patterns face to
face (with the accuracy of 1-10 um) and bond them together (high temp or
pressure are not needed).  The wafer sizes are very flexible.  Do you know
any company which provide such kind of service?  Any information which will
lead to the solution will be highly appreciated.  Thanks.

Yong



> ________________________________________________________________________
>
>  ************* __  *************   Yong Chen
> ***********   / /    ************  Quantum Science Research
> *********    / /        *********  Hewlett-Packard Laboratories
> *******     / /___ ______ *******  1501 Page Mill Road, MS 1L-14
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> ******    / / / // /_/ /   ******
> *******  /_/ /_// ____/   *******  e-mail: yongc@hpl.hp.com
> ********       / /      *********
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