aterials
Hi, everybody;
I am looking for wafer to wafer bonding method using polymer (polyimide or
etc.) or any kind of intermediate or adhesion materials for wafer-level
packaging. I need to make some space using si gasket due to protecting the
released didaphragm and paste the bottom side of the si gasket on capping si
wafer with top side of device wafer.
Any information or advice will be very appreciated.
Thanks.
Cheol Han
Agilent Technology