You might start with John Lau's recent text "Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies," ISBN: 0071351418. IEEE CPMT Journals [3 related journals as of recently] are a good up to date source. See December volumes for their Annual Indices. Advanced Packaging magazine http://ap.pennnet.com/home.cfm and HDI magazine http://www.hdi-online.com/ are good sources as well. Good luck, Michael Alderete Lead Mechanical Packaging Engineer Sensor & Electronic Systems The Boeing Company 3370 Miraloma Ave MC GB21 Bldg 231 P.O Box 3105 Anaheim CA 92803-3105 michael.alderete@boeing.com TEL (714) 762-2814 FAX (714) 762-6105 -----Original Message----- From: cheol-hyun_han@agilent.com [mailto:cheol-hyun_han@agilent.com] Sent: Thursday, February 08, 2001 3:18 PM To: MEMS@ISI.EDU Subject: Reference book for wafer-level packaging Does anybody know good reference book (or review papers) regarding wafer-level packaging (or any packaging)? Thanks. Cheol Han Agilent Technologies