I am looking for a university or company that has the facilities to deposit
a polysilicon layer with a thickness of 10 microns or greater. The
polysilicon will need to be deposited onto 4" i.e. 100 mm diameter Si
wafers. The wafers will be coated with a nitride or oxide layer before
deposition of the polysilicon - adhesion to this might be an issue. Finally,
the organisation that conducts this work will need to have established
processes for deposition of this thickness of polysilicon - so that stress
at these thicknesses is not an issue.

Many thanks


Richard Haigh


Contact:

r.d.haigh@cranfield.ac.uk