Hi Everyone.

My name is Onnop Srivannavit. I am PhD student at
University of Michigan. I have question regarding to
laser hole drilling.
As far as I know laser can drill hole on Si and glass
wafers. However I don;t know what the mechanism of
this technique is.  I wonder if anyone has technical
information about this technology. For example,

What kind of laser do they use?
Do they use different type of laser of Si and glass?
What is the smallest and biggest size we can get?


Thanks you very much for your help.

Best Regards,

Onnop
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