Hello, I am trying to find a hermetic sealing method for Plastics packaging (PEI, or PPS), glass frit method requires higher temperature than I expect. Anybody has ohter thoughts beside epoxy and welding seal? Thanks. Rong -----Original Message----- From: mems-talk-request@memsnet.org [mailto:mems-talk-request@memsnet.org] Sent: Wednesday, October 03, 2001 11:01 AM To: mems-talk@memsnet.org Subject: mems-talk digest, Vol 1 #61 - 8 msgs Send mems-talk mailing list submissions to mems-talk@memsnet.org To subscribe or unsubscribe via the World Wide Web, visit http://fab.mems-exchange.org/mailman/listinfo/mems-talk or, via email, send a message with subject or body 'help' to mems-talk-request@memsnet.org You can reach the person managing the list at mems-talk-admin@memsnet.org When replying, please edit your Subject line so it is more specific than "Re: Contents of mems-talk digest..." Today's Topics: 1. Re: Temperature measurements (Helen Berney) 2. Electric breakdown in MEMS air gap (Lidu Huang) 3. Diffusivity and Solubility of metals in Silicon (Ali Khalil) 4. Wear rate of Ni(80)-Fe(20) Permalloy (Sanghoon Lee) 5. RE: laser drilling (Tan Joo Lett) 6. Micron thickness silicon wafers (APPCHUNG) 7. surface energy of MEMS materials (Philippe Luginbuhl) 8. Re: Micron thickness silicon wafers (Kenneth Smith) --__--__-- Message: 1 Date: Tue, 02 Oct 2001 17:19:04 +0100 From: Helen BerneyOrganization: National Microelectronics Research Centre, Prospect Row, Cork, Ireland. To: G juarez Martinez , mems-talk@memsnet.org Subject: Re: [mems-talk] Temperature measurements Hi Gabriela, we have been working on performing temperature meaurements using patterned platinum resistors mounted as lids or supports for silicon microreactor cavities. We have also looked at using very small thermocouples (hair-like and quite fiddly to use) and non-contact infra-red thermocouples (in practice the least successful mode). If you would like some more information about any of these, let me know. We could also probably send you some of the platinum resistors (they are fabricated on pyrex) or if you sent over some of your devices, we could try and put together some configuration that you could use. All the best, Dr. Helen Berney. National Microelectronics Research Centre, LeeMaltings,Cork,Ireland. Tel +353-21-4904010 Fax +353-21-4270271 Email hberney@nmrc.ie G juarez Martinez wrote: > Hi! > > I am trying to measure the temperature inside miniaturised (3mmx1mm) Si > chambers. This chambers are set in a row, each of them is held at constant > but different temperature (4-40C). I have check the temperature with a > commercial temperature probe. But due that the temperature probe is too > large, I am a bit worry that I not getting an accurate reading (the > enviroment that can be affecting the temperature of the probe). > I want to do a cross checking with other technique or device.... > > Could anybody suggest one? (one that can be accurate at least at 0.5C) > > Thanks in advance, > Gabriela > **************************************************************************** ** > Gabriela Juarez-Martinez > Dep. Electronics Tel +(0) 141 330 5764 > Rankine Building. Fax +(0) 141 330 4907 > University of Glasgow > Glasgow G12 8LT > Scotland. UK. > _______________________________________________ > mems-talk mailing list > mems-talk@memsnet.org > To unsubscribe or change your list options, use: > http://fab.mems-exchange.org/mailman/listinfo/mems-talk --__--__-- Message: 2 Date: Tue, 02 Oct 2001 11:32:57 -0700 From: Lidu Huang Organization: Fujitsu Laboratories of America To: mems-talk@memsnet.org Subject: [mems-talk] Electric breakdown in MEMS air gap Hi, Could someone provide some data on electric breakdown in MEMS air gap? For usual electro-mechanical device, the electric field strength to prevent arcing is typically set at 3 (V/um). Would the breakdown strength be higher for MEMS devices? Thanks! Lidu Huang --__--__-- Message: 3 Date: Wed, 03 Oct 2001 12:02:59 +1000 From: Ali Khalil Reply-To: ali111@rsphysse.anu.edu.au Organization: ANU To: mems-talk@memsnet.org Subject: [mems-talk] Diffusivity and Solubility of metals in Silicon Hello, I would very much appreciate if anybody could provide me with the following: Diffusivity (cm2/s) and solubility of Pd, Fe and Cu in monocrystalline Si I am mostly interested in values at a temperatures above 700 C. I would greatly appreciate your help if or you can recommend a reference, web site or any info. Thank you Ali Khalil --__--__-- Message: 4 From: "Sanghoon Lee" To: Date: Tue, 2 Oct 2001 22:13:11 -0600 Subject: [mems-talk] Wear rate of Ni(80)-Fe(20) Permalloy Hi, I'm looking for some experimental data of Ni-Fe permalloy which has been used as a rotor and bearing material in a magnetic micromotor (variable-reluctance motor). Doing the frictional study of that kind of actuators, I need the wear rate and friction coefficient of the above material. Could someone provide some data? Sanghoon Lee ==================================================== Research Assistant University of Texas - Austin Dept. of Mechanical Engr. (512) 471-0968 onandon@mail.utexas.edu ==================================================== --__--__-- Message: 5 From: Tan Joo Lett To: mems-talk@memsnet.org Subject: RE: [mems-talk] laser drilling Date: Wed, 3 Oct 2001 14:23:08 +0800 If the ceramic you are using is alumina, the black spots are likely to be aluminium or some other form of aluminium oxide. What assist gas are you using? If you are using a CO2 laser, you could try using Scotch tape (and yes, I am referring to the brand. I find their Magic Tape works the best) on the surface. Of course, you'll have to clean off the adhesive later but acetone works nicely. -----Original Message----- From: Adnan Merhaba [SMTP:AMerhaba@atceramics.com] Sent: Tuesday, October 02, 2001 2:54 AM To: mems-talk@memsnet.org Subject: [mems-talk] laser drilling Hello, I have a couple of questions with regard to laser drilling of ceramics: - during laser drilling, we have observed black spots around the drilled holes, I am curious to know where do they originate from (earlier it was believed that the emulsitone that was applied onto the ceramic prior to drilling lead to carbon deposits, but I find it hard to believe that carbon doesnt get oxidized at high temperatures in an oxygen environment). - secondly is there anyway to remove slags around the holes during the drilling operation (say for e.g. by using coolants etc.), this is a concern because when we remove the slag after the drilling operation by scrubbing, we leave the substrate with plenty of scratches, so ideally I would like to remove the slag as and when they are formed. Thank you for your patience. Regards, Adnan Merhaba Thin film process engineer American Technical Ceramics Jacksonville, Florida _______________________________________________ mems-talk mailing list mems-talk@memsnet.org To unsubscribe or change your list options, use: http://fab.mems-exchange.org/mailman/listinfo/mems-talk --__--__-- Message: 6 Date: Wed, 03 Oct 2001 15:31:48 +0800 From: APPCHUNG To: mems-talk@memsnet.org Subject: [mems-talk] Micron thickness silicon wafers Hi, Does anyone know any supplier/manufacturer of 5-20 micron thick silicon wafers? Thanks! Jonathan -- Dr. Jonathan C.Y. Chung, Associate Professor G6713, Dept of Physics & Materials Science City University of Hong Kong 83 Tat Chee Avenue, Kowloon Tong, HONG KONG Tel:(852) 27887835 Fax:(852) 27887830 email: Jonathan.C.Y.Chung@cityu.edu.hk or chungchiyuen@hongkong.com --__--__-- Message: 7 From: "Philippe Luginbuhl" To: Date: Wed, 3 Oct 2001 13:38:33 +0200 Subject: [mems-talk] surface energy of MEMS materials Dear MEMS readers, I would like to now if it is possible to find informations about the surface energy (and the surface tension if it is not equal to the surface energy) of common materials used for MEMS applications, for example the surface energy of Si, SiO2, Si3N4 etc. Thank you very much Ph. Luginbuhl Dr. Ph. Luginbuhl Microflow Engineering S.A. Head of Aerosol Systems Research & Development Rue Jaquet Droz 7 CH- 2007 Neuchbtel Switzerland Phone: + 41 32 720 51 61 Phone (direct): + 41 32 720 54 78 Fax: + 41 32 720 57 89 www.microflow.ch e-mail: pluginbuhl@microflow.ch --__--__-- Message: 8 Date: Wed, 03 Oct 2001 07:21:37 -0700 From: Kenneth Smith Organization: Kmbh Associates To: APPCHUNG CC: mems-talk@memsnet.org Subject: Re: [mems-talk] Micron thickness silicon wafers The only company that I have heard of that is doing wafers this thin is Valley Design http://www.valleydesign.com They had told me in the past that they could handle a 23um request that I had at the time. I know that their thin wafers are shipped attached to their mounting medium (not sure what it is). I know of several that can do 50um, but 5-20 is well beyond their capability. Best Regards, Ken Smith Kmbh Associates 4968 Charter Road Rocklin, CA 95765 U S A 510-714-5055 Efax- 510 217 4421 or 561 658 6136 High Purity Float Zone and Specialty CZ Silicon for Power, IR and Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor applications. Service in SOI, Polishing SSP and DSP. Stock wafers in FZ, CZ and SOI ready for Immediate shipment. APPCHUNG wrote: > > Hi, > > Does anyone know any supplier/manufacturer of 5-20 micron thick silicon > wafers? > > Thanks! > Jonathan > -- > Dr. Jonathan C.Y. Chung, Associate Professor > G6713, Dept of Physics & Materials Science > City University of Hong Kong > 83 Tat Chee Avenue, Kowloon Tong, HONG KONG > Tel:(852) 27887835 Fax:(852) 27887830 > email: Jonathan.C.Y.Chung@cityu.edu.hk or chungchiyuen@hongkong.com > _______________________________________________ > mems-talk mailing list > mems-talk@memsnet.org > To unsubscribe or change your list options, use: > http://fab.mems-exchange.org/mailman/listinfo/mems-talk -- --__--__-- _______________________________________________ mems-talk mailing list mems-talk@memsnet.org http://fab.mems-exchange.org/mailman/listinfo/mems-talk End of mems-talk Digest