Ralph,

I reactively sputtered TiO2 by replacing argon by oxygen which has a major
problems because most of the oxygen ions are negatively charged and therefor
fly in the wrong direction. Thus the deposition rate is approx. 20 times
lower because of TiO2 formation on the target.

But interesting to me is how you deposit TiO2 using CVD. Which precursor do
you use ?


Regards, Stefan.