Olin makes something called 777 Etch, which contains acetic acid, ammonium
fluoride, ethylyne glycol, and water.  It is intended for use in etching SiO2
to open up bond pads.  It supposidly doesn't attack the aluminum as HF based
etches do.

>>> "Karen Smith"  10/10/01 10:18AM >>>
I have seen several references to "Pad etch" in
micromachining literature - specifically relating to
removal of a sacrificial oxide layer.

I have asked several chamical suppliers and checked
in several references to  no avail (I believe it
is a specialisat formulation (HF?) by Ashland, but
can find no reference to it on their MSDS?).

Can anyone help me with what it actually is & who
supplies it?

Best regards,

Karen Smith
MST consultant
Coventry, UK

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