I am working with wafer bonding for hermetic packaging application by using
Au thermocompression bonding. It will be very appreciated if anyone
recommend the reference papers or books regarding the mechanism, condition,
reliability and application of Au thermocompression bonding.
Cheol Han


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Cheol-Hyun Han
Product Development Engineer
Wireless Semiconductor Division, R&D
Agilent Technologies,
39201 Cherry Street, MS NK10
Newark, CA. 94560
TEL:510-505-5461
FAX:510-505-5560
EMAIL:cheol-hyun_han@agilent.com