>We have two problems we are seeking some help with:
>
>1. We want to deposit a patterned metal film onto polyimide. Any
>suggestion regarding suitable metals that give at lweast some modest
>adhesion?
>
>2.  We are also looking for a source of SiC films or diamond-like C
>fdilms or any other refractory carbide or nitride (WC, BN, etc).
>
Answer to 1.: the general use in MCM is Cr addesion layer plus Cu conducting
one; both deposited preferably by sputtering. If you want to make a multilayer
system, you must coat the copper with another Cr layer for addhesion of the
next polyimide coating. The copper layer can be thickened by electroplating.
Good luck!
Pierre.
__________________________________________________________________
Swiss Federal Institute of Technology (EPFL)
Address:  EPFL, CH-1015 Lausanne, Switzerland
Pierre Jaccard
Phone: +41(21)693 66 38
FAX:    + 41(21)693 66 70
__________________________________________________________________