>>>>>>>>>>>>>>>
Dear MEMS,

I am currently having problems electroplating small nickel features (typically
a few microns) through thick photoresist. I am unable to get the electroplating
solution (Nickel sulphate based) into all the resist openings due to the high
aspect ratios and small dimensions. I would be grateful if anyone could suggest
a suitable wetting agent to overcome this problem.

Cheers,
Mike Young.
<<<<<<<<<<<<<<<
Use Technic inc. Anti-Pit # 12,  1.5mL to 1 Liter or Mix Nickelous Chloride 5g
with Nickel Chloride Concentrate 20 mL
and 10 mL of Ant-pit 12.

Rick Bilyak
TRW/AEG
Wafer Micromachining Prodution Facility