Hello,

I intend to make a thick film (maybe 10-30um) on a Si
substrat, which is easy to deposit, develop, not
adhesive to solder metal at all and is able to survive
at a temperature higher than the melting point of the
solder. Could anybody tells me what materials and
processes should I choose and if SU8 is OK? I remember
that SU8 can be processed to stand such a temperature.

I am a rookie in MEMS. Any information is welcome!

Yours,
Alex
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