>On Tue, 11 Jun 1996, Jack W. Judy wrote:
>
>> ] Dear MEMS,
>> ]           I am currently having problems electroplating small nickel
>> ] features (typically a few microns) through thick photoresist. I am unable
>> ] to get the electroplating solution (Nickel sulphate based) into all the
>> ] resist openings due to the high aspect ratios and small
>> ] dimensions. I would be grateful if anyone could suggest a suitable
>> ] wetting agent to overcome this problem.
>> ]
>> ] Cheers,
>> ]         Mike Young.
>>
>> Mike,
>>
>> Perhaps a pinch of the surfactant "Sodium Lauryl Sulfate" will do the trick.
>> You will often find it listed on the back of shampoo bottles.
>>
>> If you add too much the bath will form a foamy head like a beer.
>>
>>
>> -Jack
>
>
>For MEMs-CMOS integration considerations, will this "Sodium Lauryl
>Sulfate" produce free sodium which could be harmful to the MOS gate oxide?
>
>
>_______________________________________________________________
>Robert Antaki
>laboratoire LISA, physique du solide
>departement de genie physique, Ecole Polytechnique
>Courrier-E: antaki@lisa.polymtl.ca
>tel: (514) 340-3716   fax: (514) 340-3706   lab: (514) 340-3717
>