Rajsekar

Your underlying problem seems to be that gold doesn't stick well to glass or
other oxides, so if your application can handle it I would recommend an
adhesion layer such as Ti.  A layer 300 Angstroms thick between the glass
and gold will do nicely.
If you still have problems, they may be dependant upon the size of the
features that you are patterning and the state of your litho process.  Check
to that your litho pattern is fully developed and no residue is left under
the metal.  If this is OK and you are working with a thick metal layer,
small feature scenario, you may have to resort to more exotic bilayer resist
solutions to achieve effective liftoff

Hope this helps

Rick

-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On
Behalf Of Rajsekhar Popuri
Sent: Friday, December 07, 2001 8:09 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] lift-off


Hello,

I am trying to do a lift-off.I sputter coated gold-palladium of 2000A
thickness on a glass wafer.When i tried to do a lift-off with
acetone-methanol,gold-palladium layer was completely peeled off the glass
wafer.Can anyone tell me the reason for this and suggest a suitable process
to do a lift-off with gold-palladium.

Thanks in advance
Rajsekhar.




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