Hi Samir

It really depends what you want to do.  There is no 'standard set of
processes' for MEMS, unlike processing for CMOS or related silicon devices.
There are certain classes of equipment that you will probably need, but even
then, there are probably exceptions even to this.

In general, you will need two classes of deposition equipment.
1) Metal deposition is often done using a sputterer, with a less common
(cheaper) option of evaporation (e-beam or thermal).  The other way of
putting metal layers down is to use wet chemistry, in a plating bath.
2) Dielectric materials (such as SiO2, Si3N4) and similar materials (DLC,
SiC) are deposited either in a furnace based system (LPCVD) or plasma based
(PECVD).

Once you have a layer, you need to pattern it.  This is done using
photoresist and a tool to expose it to ultraviolet radiation.  Photoresist
can be applied using
3) Spinner + Hotplate (to dry/bake it) or wafer track system
The resist is exposed to UV through a chrome mask containing your desired
pattern.  This needs a collimated UV beam and alignment system.  There are
several options here.
4) Contact aligner (cheapest, development work), projection aligner
(suitable for down to around 2 microns) or stepper (used for most IC work,
very expensive)
Once the resist is patterned, it needs to be developed.  This only needs a
fairly simple wet-bench and chemical + rinse tanks.
Finally, you need to etch the deposited layers.
Isotropic (same rate all directions) etching can be done using wet chemistry
in your wet bench  (don't mix acids and solvents!) but most people want
anisotropic etching.  Only some materials can be etched anisotropically
using wet chemistry (such as Si in KOH).  Normally you need a dry etcher.
5) Most versatile, cheapest, lowest rate is Reactive Ion Etching.  Faster,
better control is Inductively Coupled Plasma.  Specialised alternative is
Ion Beam Etching.

You probably need most, if not all of this, used repeatedly to build up any
useful MEMS structure.  It does not come cheap.  It has to be installed in a
clean-room, with suitable air conditioning, gas lines, compressed air,
nitrogen, power, cooling water etc.  Expect very little change from #5M for
even the most basic setup.

For more info on some of this stuff, point your browser at
www.oxford-instruments.com/plmchp5.htm (Oxford Instruments Plasma
Technology) who make quite a range of this equipment (I work for them).
Check out other sites such as www.semiweb.com for other suppliers.

Regards,

Martin Walker, Tactical Marketing Engineer, Oxford Instruments Plasma
Technology (email: martin.walker@oxinst.co.uk)

----- Original Message -----
From: "samir MEKID" 
To: 
Sent: Wednesday, December 05, 2001 4:27 PM
Subject: [mems-talk] mems lab.?


> Dear all
>
> I am not a mems specialist, can someone tell me what are the differents
> equipment we need to start with a new mems lab?
>
> thanks a lot.
>
> Sam
>
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