I did 1000A.

Yh


>From: Satej Chaudhary 
>To: mems-talk@memsnet.org
>Subject: [mems-talk] wire bonding on Ti Au
>Date: Wed, 5 Dec 2001 15:21:09 -0800 (PST)
>
> > Hi,
> >
> > I would like to know what is the minimum thickness
> > of the upper gold layer on a
> > Ti/Au pad in order to proceed to a wire bonding
> > without any risk?
>
>0.5 microns is the standard way to go i have heard
>though i havnt tried it myself.
>satej
>Grad student University of Maryland
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