Hi, friends, I am writing to seek help in wire bonding. My released
devices have perfect electical contacts (Al, 5000 Angstroms); but because
of weak mechanical adhesion to the underneath Si, when wire bonding was
performed, the Al contacts were peeled off (broken), which led to failure
in wire bonding. I am wondering if it is remotely possible that there are
some other means to bond my contacts, such as a different way of wire
bonding (not using ultrosonic) or whatever other approaches to save these
perfect devices (except this wire bonding problem). I sincerely appreciate
your help. Thanks.

Best,

Sun