Sun,

You can try thermo-compression or conductive epoxy.

Michael
ACSI

-----Original Message-----
From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org]On
Behalf Of Sun Yu
Sent: Monday, December 10, 2001 2:16 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] wire bonding


Hi, friends, I am writing to seek help in wire bonding. My released
devices have perfect electical contacts (Al, 5000 Angstroms); but because
of weak mechanical adhesion to the underneath Si, when wire bonding was
performed, the Al contacts were peeled off (broken), which led to failure
in wire bonding. I am wondering if it is remotely possible that there are
some other means to bond my contacts, such as a different way of wire
bonding (not using ultrosonic) or whatever other approaches to save these
perfect devices (except this wire bonding problem). I sincerely appreciate
your help. Thanks.

Best,

Sun
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