Hi there:
In the wave guide business we need better than 85 deg.
deep (4 - 25 um) oxide etches. Any dedicated system
there with high selectivity vs PR would be a seller.

Cheers,
Thomas
 --- BobHendu@aol.com schrieb: > I have a new design
that I would like your
> collective opinion on. First off
> how much of the MEMS work that is currently being
> done or will in the near
> future require etching of quartz pyrex or soda lime
> glass? Can anyone
> determine the range of etch depth requirements? I
> understand from talking
> with some MEMS engineers that 3 microns depth on
> pyrex or glass substrates is
> required. Also, does the profile of the etch need to
> be anisotropic is would
> a 60-70 degree slope be preferable for step
> coverage? If a slope is required
> would a wet etch with a 2% uniformity across the
> wafer be acceptable? My
> proposed design would provide the above results in a
> single wafer etch
> design. Since we build production equipment our
> ultimate design would do
> multiple wafers at a time for increased throughput.
> Does this process merit
> serious consideration and would anyone be interested
> in pursuing this process
> with us? Let me know
>
> Bob Henderson
> Process Integration,LLC
> 75 W. Baseline Rd. Suite E-32
> Gilbert, Arizona 85233
> Phone: 480-558-1156
> Fax: 480-558-1161
> email: bobh@processintegrationllc.com
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