Hi, We use an excimer laser for our ablation work - this uses mask projection so produces results in a "photolithographic-like" way. Typically the resolution of the systems is around 1 micron - so that the smallest features you can produce are of the order of a few microns in size. Holes and lines are special cases and you may be able to get these down a bit smaller in size. Aspect ratio, with all the usual problems in defining exactly what you mean by aspect ratio, is comfortably between 1 and 5, but with care and the right choice of materials we are achieving around 10 to 13. The choice of material depends a lot on what you want to do, how thick you want the structure to be, any thermal properties etc. However if you want to machine onto a silicon wafer, SU-8 photoresist baked at any temperature, or laminated dry film resists are pretty good. The advantage of the laser ablation process on SU-8 is that it can be used to remove the unwanted SU-8 after plating without any difficulty. Erol Harvey Swinburne University of Technology, Australia http://www.swin.edu.au/iris/mt/index.htm CRC for Microtechnology, Australia http://www.microtechnologycrc.com Lior Grossman wrote: > Hi, > I heard about the use of Laser Ablation for Microengineering. > I would like to structure a material with Laser ablation method (after it > was spinned on a Si wafer) > and than to fill it with metal (by PVD, Electroplating, etc.). > Do you know what is the material that I should use structuring? > Do you know the resolution of the features that I can achieve with Laser > Ablation? > > My Best Regards, > Lior Grossman > B.G. Technical Support Ltd > _______________________________________________ > mems-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.mems-exchange.org/