This has been managed before by either growing very slowly or leaving
intervals for the film to relax.
20 microns is very thick and would probably take over a week.

John


At 17:48 16/12/2001 +0200, you wrote:
>Hi All,
>I am trying to deposit 20 microns of Aluminum in Evaporation or in
>Sputtering.
>However, the film is very stress (more stress in sputtering).
>Do you know a way to reduce the stress for such films?
>
>
>My Best Regards,
>Lior Grossman; Sales Manager
>B.G. Technical Support Ltd (www.bg-tech.co.il)
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