Roger,

I'm afraid you will find that the adhesion of SU-8 is not sufficient to hold up
to a KOH or EDP etch.  If anyone knows a process to increase the adhesion of SU-
8, I sure would like to know.

Charles Ellis...
Auburn University Microelectronics Laboratory


Quoting Roger Brennan :

> Greetings:
> Is the following feasible?
> 1) Mask <100> silicon wafers having aluminum and titanium structures.
> 2) Etch holes all the way through (300 microns) etching from both sides
>
> using EDP or KOH.
> 3) Remove the photoresist without disturbing the Ti or Al.  (I worry
> about
> galvanic effects during the stripping due to the presence of Si, Ti, and
>
> Al.)
> It is my understanding that well cured SU8 might work as the resist and
>
> SMST-M might work as the stripper.  The following is all I know about
> the
> stripper:
> "SMST-M This formulation is the standard formulation. It doesn't attact
>
> metals such as aluminium, gold, titanium, chromium, but a slight attact
> of
> copper and nickel can be observed."
>
> I have contacted the vendor of the stripper, SOTEC MICROSYSTEMS SA, but
>
> often users know more than the vendor.
>
>
>
> Roger Brennan
> Home:
> 1403 Forrestal Avenue
> San Jose, CA 95110
> (408)453-0711 (telephone)
> (408)573-9407 (fax)
> rogerbr@earthlink.net
>
> Work:
> Endevco
> 355 N. Pastoria Ave.
> Sunnyvale, CA 94085
> 408-739-3533 ext 204
> roger.brennan@endevco.com
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