Hi Kaustubh,

What is the size of your wafer? How strong do you need the adhesion be? I'm
guessing that you are using 4" wafer.

I used GelPak tape for applications that you described. On one side of the
tape it is permanent adhesive and on the other side it has adhesion just
enough so that you can mount and remove a die easily (similar to using the
GelPak die containers). Give them a call and see if they have something for
you.

Good luck.

Henry

kaustubh bhate @memsnet.org on 12/21/2001 09:23:57
AM

Please respond to mems-talk@memsnet.org

Sent by:  mems-talk-admin@memsnet.org


To:   mems-talk@memsnet.org
cc:
Subject:  [mems-talk] adhesives



Hi Everybody,
I am trying to bond some pre-thinned wafers (200um
thick) with LPCVD nitride on it (1000A) - to a normal
wafer substrate(500um ) thick.I need a temporary
bonding adhesive which I should be able to remove
after I have done some etching/lithography steps on
the pre-thinned wafers.

Does anybody know of commercially available adhesives
that I can use for this? I need an adhesive which is
very  simple in it's application and ideally would
like something which I can just apply in-between the
two wafers and then stick them together and later
should be able to de-bond them easily too.

Kaustubh Bhate.

=====
Check out Yahoo! Shopping and Yahoo! Auctions for all of
your unique holiday gifts! Buy at http://shopping.yahoo.com
or bid at http://auctions.yahoo.com
_______________________________________________
mems-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/