I have not done the work myself. I have seen some papers about bonding materials
with differenet thermal expansion properties. In these papers the researchers
have annealed the wafers at low temperature, thinned one of the wafers, then
annealed at high temperature.
"wangzy-ime" on 12/31/2001 07:47:22 PM
Please respond to mems-talk@memsnet.org
To: mems-talk@memsnet.org
cc: (bcc: Dan W Chilcott/DELCO)
Subject: [mems-talk] Bonding of quarzt crystal and silicon
Hi, Guys,
Dose any one has experience in bonding single crystalline SiO2(quartz crystal)
onto silicon? How to overcome the difficulty that their thermal expansion
factors
differ significantly? What is the process? Or, Which papers give detailed
description of the bonding?
Any reply will be greatly appreciated!
Wang, Zheyao
------------------------------------------
Institute of Microelectronics
Tsinghua University
Beijing, 100084 China
Office: Room 3-309
Phone: +86-10-62789147/51 ext. 309
E-mail: wangzy@dns.ime.tsinghua.edu.cn
saab9x@yahoo.com
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