Hi Nickolay,

Cheng-Qun Gui of the Twente University did some work on it. His thesis is:

Gui, Dr.ir. C. (1998, November 13). Direct wafer bonding with chemical
mechanical polishing. Universiteit Twente, 184 pp. Promotor(en): Prof.dr.
M.C. Elwenspoek. Assistent promotor(en): Dr. J.G.E. Gardeniers. Dr. P.V.
Lambeck. ISBN 90-36512328.

And there is a website of his project.

http://www.el.utwente.nl/tdm/mmd/projects/cmp/

Hope you can use it.

Regards, Niels Olij

> -----Original Message-----
> From: Nickolay V. Lavrik [mailto:lavriknv@ornl.gov]
> Sent: woensdag 9 januari 2002 21:08
> To: mems-talk@memsnet.org
> Subject: [mems-talk] nitride to Si bonding?
>
>
> I know that standard bonding processes are
> available for materials such as Si, oxide and
> pyrex.
>
> Does any one if similar procedures exist for
> reliable (without organic adhesives) permanent
> bonding of Si and nitride coated wafers.
>
>
> Any relevant information will be highly
> appreciated
>
> Nickolay