Hi
try doing micro EDM or laser machining.
regds
Ravi Shankar
Semiconductor Complex Ltd,
India


On Mon, 14 Jan 2002, ahmed osman wrote:

> Hi all,
>
> Is there a micromachining technique that can achieve a surface 45
> degree-inclined with respect to the wafer surface? I'm not restricted to a
> specific material nor to a specific technology,but the 45-degrees should be
> achieved with high accuracy and thus i first considered wet etching in
> silicon but i failed to get the required angle by any of the known tricks.
>
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