Hello Nir,

Thanks for you response.

Our product is more on opto receiver. we are using a
silicon wafers, back side metallization is Cr & Ni,
top side is Al. We are measuring a very small amount
of leakage current (~ 50pA max)for this product.
surface contaminant is one of our hint others are
micro cracking. Currently we are maintaining a water
resistivity of 12M ohms of di-water. for micro
cracking we have no seen any, that can cause the
catastropic failure (x10 of the limit).

I hope this piece of information will some how help
you to give us other view of our problem. Thanks

Emil Burgos
Senior Process/Development Engineer

--- Nir Pernat  wrote:
> there are several dicing techniques , since I have
> worked a lot on this
> matter I think I can help you.
> we have a difficult product to dice and if you could
> give me some more info.
> on your product I can recommend a dicing technology
> for you .
> -----------------------------------
> Nir Pernat
> Process Development Engineer
>
> Phone-Or Ltd.
> 17 Hatasia St. P.O Box 323
> Or-Yahuda 60252
> Israel
>
> Tel: +972-3-634-4488 (ext. 172)
> Fax: +972-3-634-9292
> www.phone-or.com
>
>
>
> -----Original Message-----
> From: Emil Jun Burgos [mailto:emillburg@yahoo.com]
> Sent: Monday, January 28, 2002 12:45 AM
> To: mems-talk@memsnet.org
> Subject: [mems-talk] Wafer Dicing
>
>
> Hello,
>
> Can somebody point me any technical reference for
> wafer (silicon) dicing (wet process). I'm currently
> working in improving the yield of our product which
> is
> attribute to wafer dicing.
>
> Thank you very much.
>
> Emil Burgos
> Senior Process/Product Development Engineer
> Great stuff seeking new owners in Yahoo! Auctions!
> http://auctions.yahoo.com
> _______________________________________________
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