We use Shipley STR1045 and STR1075 and are very happy with them. I do not allow
SU8 in my DRIE.
Yours...
at the U of Minn

BobHendu@aol.com wrote:

> We have recently begun processing wafers using a new plasma system for doing
> deep silicon etch. Since our goal is 100 microns of vertical etch profile in
> silicon we are interested in what types of positive photoresists MEMS people
> are using. Our initial results with standard positive resist at thicknesses
> of around 1.2 microns have not yielded very consistant results. Work that we
> have done with SU-8 resist have been very good with respect to profile and
> depth of etch using a formulation of around 5 microns thickness. This also
> allows us to ash off the SU-8 after etch with little problem. My question is
> what type of resists are acceptable within the MEMS community that will yield
> at least a 4-5 micron thickness with vertical profiles using stepper or other
> alignment tools. Bob Henderson
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--
Suzanne Miller
Scientist
Microtechnology Laboratory
Institute of Technology                              612-626-2028  Phone
1-165 EE/CS Building                               612-625-5012   Fax
200 Union Street S.E.
Minneapolis, MN 55455

csmiller@ece.umn.edu
http://www.mtl.umn.edu