durusmail: mems-talk: Electrophoretic Resist on Aluminim
Electrophoretic Resist on Aluminim
Electrophoretic Resist on Aluminim
BERAUER,FRANK (HP-Singapore,ex7)
2002-02-19
Hi Roger,

We use Shipley PEPR on sputtered Al on SiC/N coated Si wafers
with anisotropically etched grooves (54.7deg corners). Results
in terms of uniformity, thickness control, adhesion and corner
coverage are clearly inferior to Cu, which this resist was de-
veloped and optimised for.
We are currently working with Shipley and Semitool to find a
different resist composition and plating parameters for Al.
Both companies are quite helpful in this respect and you might
contact them as well.
Please reply to me directly for a more detailed discussion.

Greetings,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore


-----Original Message-----
From: Roger Brennan [mailto:rogerbr@earthlink.net]
Sent: 13 February 2002 22:55
To: mems-talk@memsnet.org
Subject: [mems-talk] Electrophoretic Resist on Aluminim


Is any one out there depositing electrophoretic resist on Al on silicon
wafers?  I want to try it and have heard there are problems.  Any tips?

Thanks,


Roger Brennan
Home:
1403 Forrestal Avenue
San Jose, CA 95110
(408)453-0711 (telephone)
(408)573-9407 (fax)
rogerbr@earthlink.net

Work:
Endevco
355 N. Pastoria Ave.
Sunnyvale, CA 94085
408-739-3533 ext 204
roger.brennan@endevco.com
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