durusmail: mems-talk: Drill diameter 100um in thick glass wafer
Drill diameter 100um in thick glass wafer
2002-02-19
2002-02-20
2002-02-19
2002-02-21
2002-02-21
2002-02-21
Slow wet etch of GaAs?
2002-02-22
2002-02-25
Drill diameter 100um in thick glass wafer
Martin, Dick
2002-02-21
EDM may have a problem unless the Silicon is very heavily doped.  If the Si
conductivity is too low, you cannot get the current density high enough to
create an eroding discharge.

Dick Martin
Principal Engineer

innovative micro technology
75 robin hill road * goleta, ca 93117
ph: 805-681-2800 * fx: 805-967-2677
info@imtmems.com   * www.imtmems.com

_________________________________________
"Your strategic partner for MEMS design and 6" wafer
manufacturing services with 0.355m photolithography,
30,000 sq. ft. fab, and non-CMOS materials flexibility,
including metals/magnetics."


                -----Original Message-----
                From:   Vic Kley [mailto:vic@gennano.com]
                Sent:   Wednesday, February 20, 2002 10:24 PM
                To:     mems-talk@memsnet.org
                Subject:        Re: [mems-talk] Drill diameter 100um in
thick glass wafer

                Putting a three inch recess in a six inch wafer is a
relatively
                straightforward machining operation. Depending on finish and
depth accuracy
                there are three common ways. Lapped or diamond cut, milled,
immersion EDM.
                see your local machine shop listings.

                Vic

                ----- Original Message -----
                From: Kenneth Smith 
                To: 
                Sent: Wednesday, February 20, 2002 2:13 AM
                Subject: Re: [mems-talk] Drill diameter 100um in thick glass
wafer


                > In a similar yet different vain- anyone have a idea or
source that can
                > 'gouge' a 77mm hole 600um  deep into a 1000um 150mm
Silicon Wafer. I
                > know that I can fabricate SOI style bonded wafers with one
wafer with a
                > tru-cut, but this is expensive.
                > Any contacts or ideas let me know.
                >
                > Regards,
                > Ken Smith
                >
                > Kmbh Associates
                > 4968 Charter Road
                > Rocklin, CA  95765  U  S  A
                > 510-714-5055 Efax- 510 217 4421 or 561 658 6136
                >
                > High Purity Float Zone and Specialty CZ Silicon  for
Power, IR and
                > Mirror Optics, Optoelectronics, MEMS, SOI, and other
Semiconductor
                > applications. Service in SOI, Polishing SSP and DSP.
                > Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic
Bonding. SOG, SOS.
                >
                > Michael D Martin wrote:
                >
                > > One way to do this is to send your samples to a laser
job shop. You can
                > > use 193 nm excimers to machine glass nicely. One company
is JPSA Laser
                > > in New Hapshire, 603-595-7048
                > >
                > > -Mike
                > >
                > >
                > >>>>dleeli@hotmail.com 02/19/02 09:26AM >>>
                > >>>>
                > > I need to drill diameter 100um in thick glass
wafer(thickness is from
                > > 1mm to
                > > 3mm). would you like to help me to figure out some way
or which company
                > > can
                > > do that?
                > >
                > > thanks for your any information
                > >
                > > Dlee
                > > Research Asistant
                > > Mechanical Engineering Department
                > > University of Texas At Austin, TX
                > >
                > >
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                > --
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