Its not hard to get good results with standard doping, we've fab'ed complex
shapes from standard Boron doped silicon with both wire and full immersion
shape EDM.

Vic

----- Original Message -----
From: Martin, Dick 
To: 
Sent: Thursday, February 21, 2002 7:11 PM
Subject: RE: [mems-talk] Drill diameter 100um in thick glass wafer


> EDM may have a problem unless the Silicon is very heavily doped.  If the
Si
> conductivity is too low, you cannot get the current density high enough to
> create an eroding discharge.
>
> Dick Martin
> Principal Engineer
>
> innovative micro technology
> 75 robin hill road * goleta, ca 93117
> ph: 805-681-2800 * fx: 805-967-2677
> info@imtmems.com   * www.imtmems.com
> 
> _________________________________________
> "Your strategic partner for MEMS design and 6" wafer
> manufacturing services with 0.355m photolithography,
> 30,000 sq. ft. fab, and non-CMOS materials flexibility,
> including metals/magnetics."
>
>
> -----Original Message-----
> From: Vic Kley [mailto:vic@gennano.com]
> Sent: Wednesday, February 20, 2002 10:24 PM
> To: mems-talk@memsnet.org
> Subject: Re: [mems-talk] Drill diameter 100um in
> thick glass wafer
>
> Putting a three inch recess in a six inch wafer is a
> relatively
> straightforward machining operation. Depending on finish and
> depth accuracy
> there are three common ways. Lapped or diamond cut, milled,
> immersion EDM.
> see your local machine shop listings.
>
> Vic
>
> ----- Original Message -----
> From: Kenneth Smith 
> To: 
> Sent: Wednesday, February 20, 2002 2:13 AM
> Subject: Re: [mems-talk] Drill diameter 100um in thick glass
> wafer
>
>
> > In a similar yet different vain- anyone have a idea or
> source that can
> > 'gouge' a 77mm hole 600um  deep into a 1000um 150mm
> Silicon Wafer. I
> > know that I can fabricate SOI style bonded wafers with one
> wafer with a
> > tru-cut, but this is expensive.
> > Any contacts or ideas let me know.
> >
> > Regards,
> > Ken Smith
> >
> > Kmbh Associates
> > 4968 Charter Road
> > Rocklin, CA  95765  U  S  A
> > 510-714-5055 Efax- 510 217 4421 or 561 658 6136
> >
> > High Purity Float Zone and Specialty CZ Silicon  for
> Power, IR and
> > Mirror Optics, Optoelectronics, MEMS, SOI, and other
> Semiconductor
> > applications. Service in SOI, Polishing SSP and DSP.
> > Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic
> Bonding. SOG, SOS.
> >
> > Michael D Martin wrote:
> >
> > > One way to do this is to send your samples to a laser
> job shop. You can
> > > use 193 nm excimers to machine glass nicely. One company
> is JPSA Laser
> > > in New Hapshire, 603-595-7048
> > >
> > > -Mike
> > >
> > >
> > >>>>dleeli@hotmail.com 02/19/02 09:26AM >>>
> > >>>>
> > > I need to drill diameter 100um in thick glass
> wafer(thickness is from
> > > 1mm to
> > > 3mm). would you like to help me to figure out some way
> or which company
> > > can
> > > do that?
> > >
> > > thanks for your any information
> > >
> > > Dlee
> > > Research Asistant
> > > Mechanical Engineering Department
> > > University of Texas At Austin, TX
> > >
> > >
> _________________________________________________________________
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> > >
> >
> >
> > --
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