You can mill the glass wafer using a cnc < http://www.microkinetics.com >,
tabletop mill < http://www.sherline.com >,
using small sized router bits <
http://www.drilltechnology.com/drilltec.html >.

You may want to reduce chuck runout by replacing the standard chuck with
a precision unit < http://www.brassandtool.com/Chucks-Drill.html >.

I hope this information helps.
Good luck.

N. R. Sharma.


>In a similar yet different vain- anyone have a
>idea or source that can
>'gouge' a 77mm hole 600um  deep into a 1000um
>150mm Silicon Wafer. I
>know that I can fabricate SOI style bonded wafers
>with one wafer with a
>tru-cut, but this is expensive.
>Any contacts or ideas let me know.
>
>
>Regards,
>Ken Smith
>
>Kmbh Associates
>4968 Charter Road
>Rocklin, CA  95765  U  S  A
>510-714-5055 Efax- 510 217 4421 or 561 658 6136