Hi Connie-
        Yes, we've been bonding multi layer stacks of Si and Pyrex in our
product for 12 years now. As long as you can make electrical contact to your
center piece of Silicon, you should have no problem. You could bond the Si
to the thick glass disc, and then put the assembly back in your bonder to
attach the cover sheet, or you could bond the entire stack at once.

Phil Klauder
215-646-7400  x2151



-----Original Message-----
From: Connie Kathleen Smith [mailto:cksmith@ruf.rice.edu]
Sent: Thursday, March 14, 2002 10:46 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Anodic Bonding of Si to Pyrex


I need to bond Pyrex to both sides of a silicon wafer.  One of the pieces
of Pyrex is a full 4 inch diameter wafer (same as Si wafer)  with a
thickness of 0.5 inches.  This is used as the base for a flow cell etched
into the wafer.  The other piece of Pyrex is a cover slip for microscopy
work so it is only 0.13 mm in thickness and a 50mm square.

Has anyone ever anodically bonded pyrex to both sides?  All the literature
I read only describes the process for one side.

Thank you,
Connie Smith
Department of Chemical Engineering
Rice University
6100 Main MS 362
Houston, TX 77005
Phone 713-348-3507
Fax 713-348-5478
_______________________________________________
mems-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/