Try contacting Norm Nystrom at NYS Enterprises (408)867-5668. I beleive he has done similar processing Mac McReynolds R&D Manager Caliper Technologies Corp. 605 Fairchild Drive Mountain View, CA 94043-2234 Tel: 650-623-0710 Fax: 650-623-0521 > ---------- > From: Connie Kathleen Smith > Reply To: mems-talk@memsnet.org > Sent: Thursday, March 14, 2002 7:45 AM > To: mems-talk@memsnet.org > Subject: [mems-talk] Anodic Bonding of Si to Pyrex > > I need to bond Pyrex to both sides of a silicon wafer. One of the pieces > of Pyrex is a full 4 inch diameter wafer (same as Si wafer) with a > thickness of 0.5 inches. This is used as the base for a flow cell etched > into the wafer. The other piece of Pyrex is a cover slip for microscopy > work so it is only 0.13 mm in thickness and a 50mm square. > > Has anyone ever anodically bonded pyrex to both sides? All the literature > I read only describes the process for one side. > > Thank you, > Connie Smith > Department of Chemical Engineering > Rice University > 6100 Main MS 362 > Houston, TX 77005 > Phone 713-348-3507 > Fax 713-348-5478 > _______________________________________________ > mems-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.mems-exchange.org/