Amanda,

I've used sputtering (Au) and electroless deposition (Cu) for the
coating of SU-8 structures. Sputtering has the advantage of increased
adhesion over electroless plating, however, there are restrictions on
where the deposition takes place - for example uniform coatings on
high aspect ratio structures are problematic. In this regard
electroless is better, but in my experience the adhesion has not been
as good. This is a problem when undertaking further
electro-deposition of 'internally stressed' metal films.

Rgds

Jim.
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Dr Jim Thorpe
Research Fellow

Institute of Microwaves and Photonics
School of Electronic and Electrical Engineering
The University of Leeds
Leeds
LS2 9JT

United Kingdom

Tel: +44 (0)113 233 2049 (Office)
Tel: +44 (0)113 233 2084 (Lab)
Fax: +44 (0)113 244 9451
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