Hi Sami, everyone

We also provide etching equipment for the MEMS industry.  Our range includes
reactive ion etching (RIE), dual mode (plasma etch/reactive ion etch),
inductively coupled plasma (ICP) and ion beam etching.  The smallest systems
are non-loadlocked, small footprint systems with a lower electrode diameter
of 240mm, going up to fully clustered systems for cassette-to-cassette
operation of 300mm wafers.  Take a look at our website (see below) for more
info, or email me direct.

Regards

Martin Walker BSc(Tech) MSc
Tactical Marketing Engineer
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol BS49 4AP  UK
T. +44 (0) 1934 837031
F. +44 (0) 1934 837001
E. 
W. 


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