Hi Dinh Ton, we are using AuSn solder for wafer bumping and assembly (silicon, GaAs, InP) since more than seven years. Similar to the application you mentioned we used also a solder dam for silicon on silicon assembly and vacuum sealing of a cavity. We studied the stability of several barrier layers and investigated different bonding processes. As we are an R&D institute we would be interested to share and extend our knowledge in common projects. Please contact me for more information. Best regards, Hermann Oppermann Dinh Ton wrote: >Hi all, > >I have a question and hope if someone here can help. > >In my process, I normally do an anodic bonding step >near the end to finish off the device - top wafer is >silicon and bottom wafer is glass/Pyrex. I want to >change the process a bit by replacing the bottom wafer >with a Silicon wafer. To accomplish this glueing of >the two wafers, I want to perform some kind of Au >solder bonding or Au/Si eutetic bonding on the full >wafer scale. I wonder if anyone out there doing this >consistently enough to provide some advice. >For Au solder bonding (Au/Sn, for example), or Au/Si >bonding: >how thick of the layers do I need? barrier layer? In >the EV bonder (or other typical bonder) how much >weight need to apply and at what temperature, and for >how long? How do you go about in preparing your wafers >to get the maximum and consistent bond? Etc... > >Thank you, >MD >Yahoo! Tax Center - online filing with TurboTax >http://taxes.yahoo.com/ >_______________________________________________ >mems-talk@memsnet.org mailing list: to unsubscribe or change your list >options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk >Hosted by the MEMS Exchange, providers of MEMS processing services. >Visit us at http://www.mems-exchange.org/ > -- -- Dr. Hermann Oppermann Fraunhofer IZM Gustav-Meyer-Allee 25 D-13355 Berlin, Germany -------------------------------------------------- phone: +49-30-46403-163, -160 Fax: +49-30-46403-161 email: hermann.oppermann@izm.fhg.de -------------------------------------------------- Dept. Chip Interconnection Technologies Group Optoelectronics, HF and Sensor Integration http://www.izm.fhg.de/ http://www.izm.fhg.de/avt/index.htm http://www.izm.fhg.de/avt/opperm.htm --------------------------------------------------