Hi Manoj

The main difference between sputtering and evaporation is in the way they
coat the substrates.  Evaporation is 'line of sight' so can be used with
lift-off processes, while sputtering coats conformally, so the thickness of
metal on sidewalls is similar to that on horizontal surfaces.  If you are
depositing onto flat surfaces, then this distinction makes little
difference, but normally there is some topography present.  In conventional
IC processing, sputtering is preferred, as conductive tracks have to go over
topography without showing significant thinning (which could lead to 'hot
spots' and track failure).

We make a small sputterer, suitable for research groups needing to sputter a
number of different materials but only having a limited budget.  You can
find some details at http://www.oxford-instruments.com/PLMPDP18.htm.  If you
need any more info, email me, or contact our Indian agents in New Delhi.
The contact there is KKV Yasas at AIMIL Ltd, Tel.(+91) 116940818.

Martin Walker BSc(Tech) MSc
Tactical Marketing Engineer
Oxford Instruments Plasma Technology
North End, Yatton,
Bristol BS49 4AP  UK
T. +44 (0) 1934 837031
F. +44 (0) 1934 837001
E. 
W. 

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