Dear all,

I plan to use anisotropic wet etching to etch through holes in a <100>silicon
wafer, using LPCVD silicon nitride as mask layer,
also there is a exposed Ti/Au layer(Ti act as a adhesion layer)
on top of silicon nitride.
My concern is:

1. Will Ti/Au layer resist the long time KOH etching?
2. If KOH doesn't work, will other etchants like TMAH do?
3. Will KOH etching damage the silicon nitride membrane?

Thank you very much!

Yuanfang Gao

University of Missouri