Hi, Everyone,

I met a problem with Cu electroplating, hopefully
someone can provide me some advice.

The problem is, I want to fill a trench by Cu
electroplating with DC. The size of trench is 10um x
100um. The depth is 5um. Once I begin the plate, it
seems that Cu is growing along the sidewall instead of
filling the trench. I notice that if I grow in trench
for 1um, Cu will accumulate in the sidewall for about
3um above the surface. I wonder if anyone also has
such a problem and what is the answer to this. Someone
suggest me to do it by AC with some duty cycle, does
this method avoid this problem? Usually what is the
parameter for AC plating in the similar case?

Thank you very much and hope someone can give me some
solutiong soon!

Bert Liu
Yahoo! Tax Center - online filing with TurboTax
http://taxes.yahoo.com/