Gentlemen-
        I have developed a problem with our Sputterer recently, that has me
frustrated.
I have an MRC 943 with a DC Magnetron Cathode. I'm using it to sputter 2
microns of aluminum on Pyrex substrates. This process has been stable for
years, but suddenly my substrates are bowed and very hot to the touch when
they come out of the Sputterer.
        The only cooling in the machine has always been the water cooling of
the cathode block. The Aluminum target is clamped to that block. I am using
the same 9KW power that I have always used. The cooling water flow rate is
good. I can't figure out what has changed and I'm stumped. Any suggestions?

Phil Klauder
215-646-7400  x2151