Phil,
I belive some of the cooling water goes to cool the substrate holder also. You
might have the cooling water flowing thru the target only.

"Klauder, Jr., Philip R." wrote:

> Gentlemen-
>         I have developed a problem with our Sputterer recently, that has me
> frustrated.
> I have an MRC 943 with a DC Magnetron Cathode. I'm using it to sputter 2
> microns of aluminum on Pyrex substrates. This process has been stable for
> years, but suddenly my substrates are bowed and very hot to the touch when
> they come out of the Sputterer.
>         The only cooling in the machine has always been the water cooling of
> the cathode block. The Aluminum target is clamped to that block. I am using
> the same 9KW power that I have always used. The cooling water flow rate is
> good. I can't figure out what has changed and I'm stumped. Any suggestions?
>
> Phil Klauder
> 215-646-7400  x2151
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