Hi All,
    I'm trying to bulk etch some die we got from MOSIS and had planned
to use the TMAH+ solution (i.e. TMAH+Ammonium Peroxysulfate+silicic
acid) but we came across the following info from NIST:
http://www.mosis.org/Technical/Designsupport/nist-mems-1.html which
says you can use EDP for the post processing. Has anyone used EDP on
MOSIS chips? Is the Al alloy used in MOSIS just more resistant to it?

Any help would be appreciated
-Mike Martin