Lester,
       A number of our customers are using our plasma units for strip and
descum of Polymide and BCB.  A greater number with Polymide so I have numbers
on this process.  Using our microwave down stream unit with 2 KW power for a
single 8 inch wafer with hard baked Polymide approx 8 microns thick the
Polymide is stripped in under 5 minutes.  For descum a lower power and
temperature is used and 500 to 1,000 Angstroms is removed in under 30 seconds.
Various combinations of gas have been used from O2/CF4, O2/SF6 mixtures to gas
mixtures with Nitrogen in.  What sort of plasma system are you using?  Bill
Moffat

-----Original Message-----
From: Lester Lopez [mailto:lelopez@eng.usf.edu]
Sent: Wednesday, April 24, 2002 12:25 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Plasma etch of BCB


Has anyone attained a controlled plasma
etch of BCB > 1 um per minute using
a CF4/O2 mixture?

If so, what power level and CF4 to O2 ratio
was used?

thanks,

Lester Lopez
University of South Florida
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