What do you use to remove the teflon-like polymer (one of the most inert
things there are!) that gets stuck on the wafer during some RIE processes
(like the passivation layer in DRIE)?
I have tried 3:1 sulphuric:peroxide and oxygen plasma but that still
doesn't seem to fully take care of it -- some polymer still stays stuck in
the deep narrow trenches.
I need something that would attack the flourocarbons but not damage the
silicon.
Any ideas would be appreciated.
--Olgica
Lawrence Livermore National Lab