Dear Mr. Merhaba,

we have developed AuSn bumping about 8 years ago and used it mainly for
optoelectronics, microwave and sensor applications and we run the
bumping process for InP, GaAs and Si wafers. Please visit our homepage
http://www.pb.izm.fhg.de/avt/010_groups/030_group/FFCS.html

With various bump sizes on the same wafer you will find different bump
shapes after reflow (if you do so).

As we are an R&D institute we would be interested to share and extend
our knowledge in common projects and/or to transfer the AuSn bumping and
assembly technology. Please contact me for more information.

Best regards,

Hermann Oppermann

Dr. Hermann Oppermann
Fraunhofer IZM
Gustav-Meyer-Allee 25
D-13355 Berlin, Germany
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phone: +49-30-46403-163, -160
Fax:   +49-30-46403-161
email: hermann.oppermann@izm.fhg.de
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Dept. Chip Interconnection Technologies
Group Optoelectronics, HF and Sensor Integration
http://www.izm.fhg.de/avt/opperm.htm
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adnan merhaba wrote:

 >hello all,
 >
 >does anyone have any experiences with plating Au-Sn
 >(80-20) solder alloy, or any other viable means of
 >depositing the same (apart from screen-printing,
 >sputtering and evaporation), or is there any available
 >literature on the same.
 >
 >I am looking to plate/deposit Au-Sn on pads of various
 >sizes ranging from 100x100 mils to 20x20 mils,
 >thickness ranging from 5 micron to 50 microns.
 >
 >Thanking you in anticipation.
 >Regards,
 >Adnan
 >Yahoo! Health - your guide to health and wellness
 >http://health.yahoo.com
 >_______________________________________________
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