Hi all,

I have a problem with removal of polyimide residues under a nitride
membrane. The polyimide is removed in a pure O2-plasma since I am afraid
that any CF4 addition might hurt the nitride membrane. Apparently this
O2-plasma is not sufficient since I get small residues left with about
100-500 nm thickness.

Does anybody know about any dry etchant which can remove the last of the
polyimide without damaging the nitride membrane?


Thanks in advance

/Martin