Hi all,

What methods do people use for protecting MEMS structures after etching
and before dicing. I am aware of wafer capping (but this is expensive).
At present I handle individual die (R&D level) for etching and
immediately package the devices. Future production quantities mean that
this method not desireable. Obviously there is a wide disparity in the
type of devices that are being handled but I am specifically interested
in mechanical structures (surface or bulk MEMS). One thought is to
deposit a layer (epoxy, PR, or other) with low-viscosity and no
shrinkage during cure. This would fill the cavities and allow for wafer
sawing without breaking devices (theoretically). The material would have
to be easily removed through either a gas phase etchant or liquid soln
(with little to no energy...no ultrasonic or high temp). It is
desireable to handle these as a wafer...for obvious reasons.


Any thoughts or insights


Derek Strembicke
Principal MEMS/VLSI Design Engineer
Stremco Research
P.O. Box 2185
Huntsville, Al, 35804-2185

ph: (256) 653-3423
email: strem@ieee.org